Lightspring

Lightspring was founded in Besançon, France in 2026, spun out of the FEMTO-ST institute. It uses 3D lithography to turn optical packaging for photonic chips into a single programmable process, replacing piece-by-piece micron-scale active alignment and targeting co-packaged optics (CPO), the toughest manufacturing step in AI infrastructure. In September 2026, Lightspring closed a €3.1 million seed round, bringing total funding including grants to over €3.5 million.